Quality Management

August Electronics > Quality Management

Quality delivered

We have an extensive and formal Quality Management system that documents non-conformances, tracks defects, and drives systematic continual improvement. We have a long-standing track record of consistently exceeding client expectations for quality.


August Electronics holds the following quality standards and certifications.

ISO 9001

August Electronics’ management system has been certified to ISO 9001, demonstrating our commitment to quality, continual improvement, and client satisfaction.


We take pride in providing a superior level of quality to our clients, that’s why our purpose-built manufacturing facility is fully certified and approved for manufacturing to CSA, UL and ETL standards.


August Electronics manufactures to IPC-A-610 Class 2 or 3 and restores electronic assemblies to IPC-7711 Class 2 or 3 to ensure superior quality, reliability and consistency in all our electronics assemblies. We have an in-house IPC certified trainer and all of our production experts are certified to build to IPC-A-610 Class 2 or 3 and rework or repair electronic assemblies to IPC-7711.

APEGA Permit Holder

August Electronics is a member in good standing with APEGA, and holds a permit to practice engineering in the province of Alberta.


How we measure and control quality.

Our established quality management system requires the performance of our manufacturing processes to be measured, analyzed and continually improved. We have refined our quality management system over our nearly 30 years in business to ensure predictable and repeatable outcomes.

We employ a battery of quality control and assurance measures through our quality management system by strategically implementing various inspection and test stages during the PCB assembly and final box build assembly processes. This ensures all products are highly reliable, adhere to cosmetic and workmanship standards and comply with client supplied fabrication and assembly documentation.

Every PCB assembly and final box build or electro-mechanical assembly undergoes the following:

  • Solder paste inspection (SPI)
  • Pre-reflow inspection
  • 3D Automated optical inspection (AOI) post reflow
  • X-ray inspection
  • Visual inspection
  • In-circuit testing (ICT)
  • Dielectric testing or “hipot” tests
  • Functional testing
  • Final assembly AQL inspection and sampling audits

Click the link to learn more about our inspection and testing capabilities or contact us today to discuss your specific electronic manufacturing quality control and assurance requirements.